In electroplating contaminations, residues or inclusions in the product can quickly lead to a marked product quality reduction or even to failure of full batches. Similar contaminations & defects of ...

Electroplating has evolved into a sophisticated technique that not only deposits metal layers but also enhances the durability and corrosion resistance of substrates. By utilising controlled ...

Electroplating is a simple and low-cost process that produces a uniform and dense coating with good adhesion to the substrate. This method is also suitable for coating complex-shaped interconnects.

SAN JOSE–Enabling a new round of copper-based devices, Novellus Systems Inc. today (December 1, 2003) rolled out its next-generation electrochemical plating (ECP) tool for use in 65- and 45-nm chip ...

Applied Materials, Inc. introduces its 300mm SlimCell(TM) electrochemical plating (ECP) system that overcomes the limitations of existing plating technology to deliver a cost-effective, ...