Rivian announced a series of hardware and software developments intended to support its long-term autonomy and artificial ...

US automotive company Rivian is advancing its vertically integrated vehicle technology through a proprietary, purpose-built ...

EV manufacturer Rivian, a key partner of Volkswagen, unveiled its own in-house developed silicon chip at its first 'Autonomy ...

Rivian announced significant breakthroughs in vertically integrated automotive technology at its first Autonomy & AI Day.

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

Energy/bit optimization approach for multi-chip systems with possibility of co-optimization with the routing resources defined by the signalling pitch. December 7th, 2022 - By: Fraunhofer IIS/EAS More ...

Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...

ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, today introduced a family of high speed, energy-efficient Single Flux Quantum (SFQ) digital chips capable of running all ...

Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

Osram Opto Semiconductors has introduced the first compact laser multi-chip package. The PLPM4 450 module can pack up to 20 blue laser chips into a single "butterfly" package for projection ...