Abstract: Embedded packaging of wide-bandgap (WBG) power modules offers an inherently lower parasitic inductance, higher switching frequency, and lower power losses compared to traditional ...

RF front ends are advancing through the integration of high-frequency passive networks with increasingly efficient active devices engineered for ultra-wide bandwidths and constrained power envelopes.

Abstract: Sapphire substrates have recently been recognized for their potential to improve the coherence time of superconducting qubits. However, due to challenges in via fabrication, silicon ...